Yiming Huai

Yiming Huai

Affiliation
Avalanche Technology
IEEE Region
Region 06 (Western U.S.)
(
Country
USA
)
Technical Area
Advanced Characterization, FePt Media, Magnetic Micro-systems, Magnetic Multilayers, Magnetic Nanoparticles, Magnetic Nanostructures, Magnetic Recording, Magnetic Thin Films, Magnetization Dynamics, Magnetoelectronics, Materials Modelling, Micromagnetics, MRAM, Multiferroics, Nanomagnetism, Neutron Scattering, Oxide Thin Films, Research, Sensors, Spin Orbit Torque, Spintronics, Ultrafast Spin Dynamics
Email
Spoken Languages

English

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Dr. Yiming Huai serves as CTO and VP of Technology & Foundry Business at Avalanche Technology, a world’s leading provider of STT MRAM technology and products. He leads Avalanche STT MRAM technology/product development and manufacturing in collaboration with top-tier foundries.

Prior to joining Avalanche, Dr. Huai was co-founder, board member and CTO of Grandis, Inc., a pioneer in Spin Transfer Torque MRAM (STT MRAM). Grandis was acquired by Samsung in 2011. While at Grandis, Yiming successfully raised more than $30 M in private and government funding. He led the team to first demonstrate spin transfer switching in magnetic tunnel junctions, creating a foundation for STT MRAM commercialization. Prior to Grandis, Dr. Huai served as Sr. Director of Thin Film of Manufacturing at Read-Rite Corporation (now Western Digital) from 1996 to 2002, where he led the development and volume production of industry leading GMR heads for hard disk drives. He previously worked as a Staff Scientist at the Lawrence Livermore National Laboratory (LLNL) and as a Post-Doctoral Fellow at the National Research Council in Ottawa, Canada. He received M.S. and Ph.D. degrees, both in Physics, from University of Montreal in Canada. He has an H-index of 87 with more than 20,500 citations. He has authored or co-authored more than 120 papers, holds more than 180 issued patents. He has delivered over 90 keynote and invited speeches on STT MRAM technology and commercialization.

Recognitions:
  • 2024 IEEE Fellow
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